粉體行業(yè)在線展覽
粉體行業(yè)在線展覽
無(wú)鹵，高CTI，膠膜型鋁基覆銅板
直接聯(lián)系
生益科技
江蘇
面議
無(wú)鹵，高CTI，膠膜型鋁基覆銅板
3052
1. Typical value is based on specimen of 1.5mm Al/100μm dielectric/1oz Cu.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Thermal Conductivity | ASTM-D5470 | A | W/ (m?K) | 2.1 |
| Thermal Resistance | ASTM-D5470 | A | K·cm2/W | 0.52 |
| Tg | 2.4.25D | DSC | ℃ | 160 |
| Td | 2.4.24.6 | Wt 5% loss | ℃ | 395 |
| Thermal Stress | 2.4.13.1 | 288℃, solder float | min | 30 |
| CTE (Z-axis) | 2.4.24 | Before Tg | ppm/℃ | 17 |
| After Tg | ppm/℃ | 39 | ||
| 50-260℃ | % | 0.69 | ||
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 108 |
| Surface Resistivity | 2.5.17.1 | C-96/35/90 | MΩ | 108 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 5.0 |
| Hi-pot Test | CPCA4105-2012 | DC | V | 4000 |
| AC | V | 3000 | ||
| Peel Strength (1oz) | 2.4.8 | 288℃/10s | N/mm | 1.3 |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 |
| MOT | UL | A | ℃ | 130 |
| CTI | IEC60112 | A | Rating | PLC0 |
無(wú)鹵無(wú)磷覆蓋膜
高頻高速基材
封裝基板用高性能基板材料
高Tg，高模量，IC封裝載板
無(wú)鹵，高CTI，膠膜型鋁基覆銅板
無(wú)鹵，高CTI，鋁基覆銅板
ST115G
AeroWave 300
LNB33
SCGA-500 GF220
mmWave77
Autolad3
AI領(lǐng)航系列
Grinder
1.5T/850型
氣流粉碎機(jī)配件－分級(jí)輪
略
無(wú)
IC412C/612C/812C/912C
PP
略
WBC-800
略
機(jī)型 - PT、MIC、DISC
