粉體行業(yè)在線展覽
粉體行業(yè)在線展覽
高Tg，高模量，IC封裝載板
直接聯(lián)系
生益科技
江蘇
面議
高Tg，高模量，IC封裝載板
2122
產(chǎn)品性能：
All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
| Items | Condition | Unit | SI643HU | SI643U |
|---|---|---|---|---|
| Tg | DMA | ℃ | 245 | 230 |
| Td | 5% wt. loss | ℃ | 409 | 400 |
| CTE (Z-axis) | x/y-axis(α1) | ppm/℃ | ~10 | 12-13 |
| (40-260℃), z-axis(α1/α2)1) | ppm/℃ | 25/143 | 27/150 | |
| Dielectric Constant (1GHz) | - | - | 4.5 | 4.4 |
| Dissipation Factor (1GHz) | - | - | 0.007 | 0.007 |
| Solder Dipping | 288 ℃ | min | >30 | >30 |
| Peel Strength 1) | 1/3 Oz, VLP Copper Foil | N/mm | 0.73 | 0.8 |
| Young’s modulus | 50℃ | GPa | 25 | 22 |
| 200℃ | GPa | 22 | 15 | |
| Flexural modulus1) | 50℃ | GPa | 28 | 26 |
| 200℃ | GPa | 18 | 16 | |
| Water Absorption1) | A | % | 0.17 | 0.2 |
| 85℃/85%Rh, 168Hr | % | 0.54 | 0.63 | |
| Flammability | UL-94 | Rating | V-0 | V-0 |
| Thermal Conductivity | - | W/(m·K) | 0.61 | 0.58 |
